3D IC

By: Siemens Digital Industries Software
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  • Summary

  • Three-dimensional integrated circuits take less space and deliver higher performance.
    Siemens Digital Industries Software
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Episodes
  • Uncovering 2.5D and 3D IC Tests

    Uncovering 2.5D and 3D IC Tests
    Feb 13 2023
    One of the best ways to speed-up product development is to integrate test as early as possible in the design cycle. This shift-left strategy becomes even more critical when advanced IC designs evolve from a single die per package to complex systems with multiple dies integrated into a package. These 2.5D and 3D multi-die design strategies pose some interesting challenges and opportunities for test. Today, David Lyell interviews Joe Reynick, the Tessent Product Engineering Manager for Siemens EDA. He’ll help us to understand the complexity of development tests for 3D and 2.5D packages. In this episode, you’ll learn about the challenges of performing comprehensive tests on 3D and 2.5D designs. You’ll also hear about the factors that you need to consider while planning for 3D DFT and IP tests. Additionally, you’ll hear about how 2.5D tests and 3D tests can complement each other. What You Will Learn In This Episode: The things you need to be aware of when doing 2.5D and 3D tests (03:34) The DFT and IP test methods that the DFT and IP test team should implement (09:36) The die and package level planning interactions needed for 3D DFT and IP test (11:22) Factors to consider while doing 3D tests (14:20) What is involved in multi-die IP core test (16:00) Connect with Joe Reynick:  LinkedIn Connect with David Lyell:  LinkedIn Hosted on Acast. See acast.com/privacy for more information.
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    21 mins
  • Getting Started with 3D IC

    Getting Started with 3D IC
    Nov 8 2022
    3D IC designs are complex puzzles that engineers have to solve to achieve high performance and reliability. While vertical stacking gives more design options, it also increases the possible number of defective arrangements. There is no one-design-fits-all in 3D IC; engineers must understand their needs and create designs that meet them. Today, John McMillan interviews John Ferguson, Product Management Director of Calibre DRC Technologies at Siemens Digital EDA. He’ll help us understand the complexity of 3D IC designs and how it impacts their reliability. In this episode, you’ll learn about some of the guardrails that increase the reliability of 3D IC devices. You’ll also hear about some of the common challenges an engineer has to solve while designing such devices. Additionally, you’ll get some tips on where to start with 3D IC designs to minimize cost and maximize performance. What You Will Learn in this Episode: Improving the reliability of heterogeneous assemblies (01:36) Solving the heat problem in heterogeneous assemblies (07:46) The sources of mechanical stress in 3D IC assemblies and how to address them (14:44) Where to start when designing 3D IC devices (22:07) Connect with John Ferguson:  LinkedIn Connect with John McMillan:  LinkedIn Hosted on Acast. See acast.com/privacy for more information.
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    27 mins
  • 3D IC Integration Challenges

    3D IC Integration Challenges
    Jul 12 2022
    A common challenge faced when actualizing new technologies such as 3D IC is the lack of specialized tools to mass assemble them. That’s because their designs are normally developed by R&D teams that view commercialization as someone else’s task. At the moment, organizations are working to create and perfect the tools need to assemble 3D IC chips. Today, John McMillan interviews John Ferguson, Director of Product Management, Dusan Petranovic, Principal Technologist, and Steve McKinney, Account Technology Manager. They’ll help us understand what a 3D IC verification workflow might look like. In this episode, you’ll learn about the challenges associated with 3D IC integration and the components required to make it possible. You’ll also learn about the upgrades that have to be made to make 3D IC assembly possible. Additionally, you’ll hear about parasitic extraction and the tools available to execute it. What You Will Learn In This Episode: Challenges faced in the manufacture of 3D IC chips (02:01) How to ensure that a 3D IC assembly line is aligned (04:18) The challenges of integrating 3D IC (10:55) The tools needed to make 3D IC integration possible (13:56) Connect with Dusan Petranovic:  LinkedIn Connect with Steve McKinney:  LinkedIn Connect with John McMillan:  LinkedIn Hosted on Acast. See acast.com/privacy for more information.
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    21 mins

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